News: Microelectronics
13 August 2026
BAE Systems advances to Phase 2 of DARPA’s THREADS program
BAE Systems Inc says that its FAST Labs research, development and production organization of Nashua, NH, USA has completed Phase 1 of the US Defense Advanced Research Projects Agency’s (DARPA) program Technologies for Heat Removal in Electronics at the Device Scale (THREADS) and has been awarded continued support to move into Phase 2.
The THREADS program aims to overcome temperature limitations in high-performance radio frequency (RF) electronics, specifically in gallium nitride (GaN) devices. Overcoming these limitations will significantly increase the power and range of vital military systems.
“The progress we’ve made during Phase 1 validates our approach to material and process enhancements and brings us closer to unlocking the full potential of RF-based systems for our warfighters,” says Isaac Wildeson, principal investigator at BAE Systems’ FAST Labs.
Successful thermal management developed through this program is expected to nearly triple the range of RF systems, enhancing the safety and engagement distances for military personnel. BAE Systems’ work on THREADS is being conducted at its Microelectronics Center (MEC) in Nashua, NH, USA, a Department of War (DoW) Category 1A Trusted Supplier, leveraging its established expertise in the development and manufacturing of GaN and gallium arsenide integrated circuits.
To accelerate the development of this critical technology, BAE Systems’ work on the THREADS program includes collaboration with Modern Microsystems, Penn State University, Stanford University, the University of Notre Dame, and the University of Texas at Dallas.
BAE Systems awarded $12m THREADS contract to boost effectiveness of RF-based applications
