News: Optoelectronics
2 June 2026
Sivers and GlobalFoundries to develop silicon photonics for AI infrastructure
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic collaboration with GlobalFoundries of Malta, NY (GF, the only US-based pure-play foundry with a global manufacturing footprint, including facilities in the USA, Europe and Singapore) to develop silicon photonics solutions for the high-growth AI infrastructure market.
Sivers’ laser arrays will be integrated into reference designs built on GF’s silicon photonics platform. The collaboration supports a range of optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data-center interconnect solutions. The laser arrays will also be available in GF’s Silicon Photonics Co-packaged Advanced Light Engine (SCALE) platform for next-generation optical sub-assemblies and light engine architectures. GF’s SCALE CPO solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and advanced packaging enablement to improve bandwidth density and system scalability.
“The rapid expansion of AI workloads and hyperscale data-center architectures demand advanced photonics technologies that deliver higher bandwidth, improved energy efficiency, and scalable optical connectivity,” says Sivers’ chief revenue officer Raymond Biagan. “Our collaboration with GlobalFoundries positions both companies at the leading edge of silicon photonics innovation,” he adds.
“GlobalFoundries continues to see strong momentum for silicon photonics solutions as AI data-center architectures evolve toward higher bandwidth density and improved power efficiency,” says Vikas Gupta, senior fellow, Silicon Photonics product line at GF. “Pairing Sivers Semiconductors’ laser array technology with our silicon photonics and SCALE CPO platforms provides our customers with advanced, scalable optical engine solutions for high-bandwidth co-packaged optics and optical interconnects.”
