News: Microelectronics
8 June 2026
QPT unveils AI-driven design service for optimizing thermal interface layer
Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based electric motor controls — has unveiled qDesign, an AI-driven generative design service that programmatically generates, simulates and iterates on QPTs patented qAttach thermal interface layer for any power module, replacing weeks of human-in-the-loop CAD and simulation cycles with AI-generated topologies and automated optimization.
Ahead of its showcase at the PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), QPT is opening qDesign to semiconductor and power module manufacturers as a partnered engineering service, optimizing the qAttach layer for each customer’s specific die, substrate, heatsink and operating envelope.
QPT’s qAttach layer is reckoned to deliver up to 15x better thermal performance over existing alternatives on the market and enables 1MHz+ hard-switching, a step change for performance, power density and system costs in motor drives and AI data-center power supplies.
The qDesign AI platform closes the loop between geometry generation, thermal-mechanical simulation and design iteration. A trained AI model produces a validated qAttach geometry that integrates with the customer’s existing module; each candidate is dispatched automatically to cloud-based finite-element analysis for full thermal and stress evaluation. Results gate the next generation, converging on a geometry tuned to the customer’s specific thermal and reliability requirements. Every revision is captured as a traceable deliverable; parametric inputs, simulation results, and AI-generated engineering drawings and reports ready for human review.
New approach to packaging design
Conventional die-attach design relies on human-led CAD iteration, with each thermal-mechanical revision taking days or weeks of engineering time. This is especially true with the complex geometries that deliver the thermal and mechanical performance of qAttach. The complexity of optimizing a qAttach geometry, balancing ultra-thin bond lines for thermal performance against stress relief for reliability, compounds this cost, and the search space is too large for a human designer to explore exhaustively.
qDesign is said to break this barrier. By automating the generate-simulate-iterate loop, the service explores thousands of candidate geometries in the time a human engineer would evaluate one, and discovers complex topologies that a human designer would never reach. The qAttach layer that emerges is not a standard part, but a geometry tuned to the customer’s die size, power density, substrate stack, target requirements and manufacturing constraints.
What qAttach unlocks
First announced in December 2024, QPT's qAttach technology removes waste heat from power semiconductor dies up to 15x faster than conventional sintered die-attach processes, it is reckoned. This is achieved through an ultrathin bond layer with a proprietary geometry that constrains thermal expansion, eliminating the delamination that is the leading cause of failure in conventional power packages.
For customers, the system-level benefits include:
- Higher power density — enabling smaller, lighter modules with much improved thermal performance.
- Greater reliability — substantially reducing the delamination failure mode that limits the lifetime of conventional packages.
- Higher switching speeds — the improved thermal headroom unlocks the ultra-high-frequency GaN switching that underpins QPT's 1MHz motor drive platform, with similar benefits to AI data-center PSUs and GPU cooling.
- Manufacturing flexibility — the qAttach process operates at lower pressures than sintering, reducing mechanical stress on dies during assembly.
A service, not a product
qDesign is being offered as a partnered engineering service to semiconductor manufacturers, power module OEMs, and system integrators. Customers bring their module specification; die geometry, substrate stack, heatsink interface, and thermal and stress targets, and QPT runs the qDesign pipeline against it, delivering an optimized qAttach geometry that the team can map from their integrated lab-based process to existing semiconductor manufacturing processes.
“qAttach benefits increase considerably with per-application optimization,” says founder & chief technology officer Rob Gwynne. “Every customer's die, substrate and thermal environment is different, and the geometry that extracts the most performance for one module isn’t the same as for another,” he adds. “qDesign is what makes that practical at scale. It lets us deliver a tuned qAttach layer for each customer in minutes rather than months. For semiconductor and module manufacturers looking to push beyond what their current packaging can deliver, this is the fastest route to a qualified, optimized design.”
qDesign at PCIM Europe 2026
At PCIM Europe, visitors can see the pipeline running live, discuss qAttach optimization for their own modules, and book follow-up engineering engagements.
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