News: Optoelectronics
18 March 2026
Lumentum showcases optical scale-up demo at OFC using VCSELs
In booth #1439 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) has announced an optical interconnect solution designed to support next-generation AI infrastructure using vertical-cavity surface-emitting laser (VCSEL) technology. This solution offers a scalable optical platform for next-generation rack-level architectures to address the bandwidth, power, and integration challenges of AI scale-up networks.
The solution is presented in a host evaluation system and features a high-density multi-mode 1060nm VCSEL array co-packaged with a host ASIC, targeting ‘slow and wide’ scale-up protocols such as UCIe and PCIe. It is implemented in a fan-out wafer-level package, leveraging standard semiconductor packaging flows, and advanced multi-mode fiber connectivity.
The 1060nm VCSELs and photodetectors are integrated in a two-dimensional monolithic array incorporating backside lens technology to enable precise optical alignment and superior signal integrity. The array architecture also supports channel sparing for enhanced system reliability. Designed for demanding environments, the platform supports high-temperature operation exceeding 150°C and leverages the inherent reliability advantages of 1060nm VCSEL technology.
The 1060nm VCSEL platform is built on Lumentum’s ultra-high-volume 3D sensing (3DS) manufacturing base, which has shipped more than 10 billion emitters to date. Compared to conventional 850nm datacom VCSELs, 1060nm devices are said to deliver improved speed capability, superior high-temperature performance, and exceptional long-term reliability. As a VCSEL-based scale-up solution, the platform also provides an independent supply chain alternative to silicon photonics and indium phosphide (InP) laser-based architectures.
“AI infrastructure is pushing the limits of conventional electrical interconnects,” says chief technology officer Matt Sysak. “Our 1060nm VCSEL scale-up platform optically enables ASICs with high shoreline bandwidth density, strong signal integrity, and thermal resilience, while providing a differentiated and highly reliable alternative to traditional silicon photonics-based approaches.”
