News: Suppliers
18 March 2026
Teradyne launches Photon 100 opto-electric automated test platform
Automated test equipment and advanced robotics provider Teradyne Inc of North Reading, MA, USA has launched the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.
As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing, says Teradyne. By integrating optical and electrical instrumentation with Teradyne’s proven UltraFLEXplus platform, the Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions. This is said to simplify operations, accelerate time-to-market, and enable rapid scaling for silicon photonics and co-packaged optics manufacturing.
The Photon 100 provides a “comprehensive, scalable and integrated solution that simplifies the complexities of high-volume silicon photonics and co-packaged optics testing,” says Geeta Athalye, vice president of Silicon Photonics Test. “The integration of the proven Teradyne UltraFLEXplus platform with state-of-the-art optical and electrical instrumentation ensures seamless performance at scale today and the flexibility to evolve alongside our customers’ needs as the industry continues to innovate.”
Key features and benefits are cited as:
- Integrated Optical & Electrical Instrumentation: Combines advanced optical and electrical test capabilities.
- Scalable for High-Volume Manufacturing: Designed to support the rigorous demands of high-volume SiPh and CPO production environments.
- Comprehensive Test Coverage: Supports wafer (single- and double-sided), optical engine, and CPO test insertions.
- Customizable Optical Instrumentation: Standard configuration available, with the ability to tailor optical instrumentation if needed.
- Operational Simplicity: Designed, built and maintained by Teradyne, eliminating the need for customers to integrate and support multi-vendor solutions.
- Open Ecosystem: Customers can choose their preferred ecosystem partners for high-volume manufacturing, including wafer-level and die-level probe options.
Teradyne says that, with the Photon 100, it is delivering an integrated, scalable and automated solution for the most advanced manufacturing challenges. By combining optical and electrical instrumentation with the proven UltraFLEXplus platform, it empowers users to accelerate innovation, reduce operational complexity, and scale production to meet the growing demands of AI and next-generation data centers, the firm adds.
Teradyne is exhibiting in booth 4732 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March).
Teradyne announces production system for double-sided wafer probe test for silicon photonics
