News: Suppliers
6 May 2026
Xanadu and EVG partner on heterogeneous integration and wafer bonding processes for photonic quantum systems
Photonic quantum computing company Xanadu Quantum Technologies Ltd of Toronto, ON, Canada, and EV Group of St Florian, Austria — a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications — have announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.
EVG’s industrial manufacturing tools will be used to fabricate the specialized chips used in Xanadu’s photonic quantum computers, with the goal of accelerating the progression of quantum computing chip manufacturing from the lab to high-volume production.
As the semiconductor and photonics industries evolve, heterogeneous integration has emerged as a high-growth frontier. It allows for the seamless combination of multiple functional materials and platforms — such as silicon, lithium niobate, and III-V semiconductors — onto a single, unified chip. EVG says that its bonding expertise is helping Xanadu to engineer the high-precision and ultra-clean interfaces required to bring together the photonic chip material stack across different platforms. This process is integral to Xanadu’s mission of building a quantum data center that is both manufacturable and scalable.
“Heterogeneous integration is the key to unlocking the next generation of photonic performance,” says Xanadu’s founder & CEO Dr Christian Weedbrook. “Working with EV Group allows us to push the boundaries of what’s possible on-chip, bringing us ever closer to a useful, large-scale quantum data center,” he adds.
Picture: Xanadu team visits EVG's headquarters. From left to right: EVG’s strategic account manager North America Joe Battaglia and executive sales & customer support director Hermann Waltl; Xanadu’s engineering manager - process integration Oliver Herrmann and senior process development engineer Ron Then; and EVG’s VP & general manager North America Dave Kirsch and VP of sales Dr Thomas Uhrmann.
“This partnership is a clear demonstration of how established semiconductor technologies can accelerate next-generation high-performance computing, and quantum is the next frontier,” says EVG’s executive technology director Paul Lindner. “We are proud to support Xanadu by providing the high-precision bonding and interface engineering solutions required to unite and scale complex photonic platforms,” he adds. “This collaboration demonstrates how our advanced integration technologies are paving the way for the quantum computing era.”
The collaboration is working towards a shift from demonstrator systems to industrial-scale quantum hardware. By leveraging EVG’s bonding solutions, Xanadu is streamlining the transition of complex photonic circuits from specialized labs to standard semiconductor foundries, accelerating the timeline for a commercially viable, fault-tolerant quantum computer.
EVG highlights heterogeneous integration technologies at ECTC
