News: Suppliers
6 October 2026
SawStreet joins WIN Alliance Partner Program
WIN Semiconductors Corp of Taoyuan City, Taiwan — which provides pure-play gallium arsenide (GaAs) and gallium nitride (GaN) wafer foundry services for the wireless, infrastructure and networking markets — has added quick-turn semiconductor backend service provider SawStreet LLC of Orlando, FL, USA to its WIN Alliance Partner Program. The partnership complements WIN’s in-house backend processes, giving customers another trusted partner for wafer grinding and thinning, dicing, pick-and-place and die inspection.
SawStreet handles thicknesses as low as 50µm, and specializes in wafer grinding and thinning, including dice-before-grind (DBG), along with precision dicing, high-speed pick & place, and visual die inspection to MIL-STD-883 Condition A or B, or to customer internal specifications.
“SawStreet has spent years handling GaAs, GaN and InP wafers for demanding commercial, defense and space programs, and we understand how much value sits on a single wafer by the time it leaves a fab like WIN’s,” says SawStreet’s president & CEO Jim Young. “Joining the Alliance gives WIN customers a US-based partner for backend processing, with the quick-turn schedules and handling discipline those programs require,” he adds.
“Adding SawStreet to the WIN Alliance gives our customers an alternate backend processing option that complements the services WIN already provides,” says Russ Wagner, WIN’s VP of business development. “Their expertise adds another layer of support for customers looking to reduce overall wafer processing cycle time.”
