News: Optoelectronics
22 September 2026
Coherent launches PhotonLink integrated optics platform for AI infrastructure
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has announced PhotonLink, an integrated optics platform that brings together Coherent’s broad portfolio of critical photonics technologies, precision assembly and test capabilities to deliver complete optical solutions for next-generation AI data centers. The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip-to-chip connectivity.
As AI systems continue to scale, demand for higher bandwidth and lower power is driving optical connectivity closer to compute and switching silicon. These architectures require lasers, silicon photonics, precision optics, fibers and detectors to work together. PhotonLink brings those technologies and the expertise to integrate them into one platform.
“The next leap in AI requires more than faster chips – it requires a new way to connect them,” says CEO Jim Anderson. “Customers need complete optical solutions, not just individual components. Coherent is uniquely positioned to bring together the critical technologies, integrate and test the finished assemblies, and manufacture them at scale,” he claims. “PhotonLink puts that capability to work for the next generation of AI infrastructure.”
Coherent’s vertical integration spans compound semiconductor materials, lasers, optics and specialty fiber through final assembly and test. PhotonLink gives customers access to both individual components and complete optical assemblies from one partner, helping to simplify system design, streamline qualification and reduce the complexity of integrating technologies from multiple suppliers.
From critical technologies to complete optical assemblies
The PhotonLink platform spans four functions of the optical path: Generate, Shape, Guide and Receive. The portfolio includes indium phosphide (InP) lasers, vertical-cavity surface-emitting laser (VCSEL) arrays, silicon photonics, isolators, specialty fibers, micro-optics and detectors. Coherent integrates these technologies into external laser sources, precision fiber assemblies and optical modules tailored to customer architectures.
Customer engagement and manufacturing scale
Coherent says that it has more than ten CPO customer engagements and more than ten NPO engagements, with anchor customers and long-term agreements secured for both architectures. It also has more than five engagements in emerging chip-to-chip connectivity. Revenue from the PhotonLink platform is expected to begin ramping in fourth-quarter 2026.
PhotonLink builds on Coherent’s established data-center manufacturing base, which has shipped more than 300 million InP lasers and more than 1 billion InP and gallium arsenide (GaAs) photodetectors. Coherent is expanding its 6” InP and specialty fiber manufacturing capacity to support the PhotonLink ramp.
PhotonLink launch at ECOC 2026
Coherent hosted a PhotonLink launch event on 21 September at the Gran Hotel Miramar during the European Conference on Optical Communications (ECOC 2026) in Málaga, Spain (21–23 September), where the firm was exhibiting on stand 2100 (Hall 2) at the Palacio de Ferias y Congresos de Málaga (FYCMA).
Coherent to receive $50m US CHIPS Act funding to expand Sherman 6-inch InP fab
