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Latest issue of Semiconductor Today now available

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine.

Published today and free of charge, Semiconductor Today’s latest issue covers all that is new in gallium arsenide (GaAs), indium phosphide (InP), nitrides, silicon carbide (SiC), silicon germanium (SiGe) and other compound semiconductor materials. The magazine also covers the devices and applications that these materials enable.

Click here or issue cover for direct access

 

Articles in this issue include:

  • More thermally stable InP quantum dot near-infrared laser diodes
  • First cw UV VCSEL operation at room temperature
  • Reducing micro-LED sidewall impact
  • Weak polarization electric-field c-plane GaN LEDs
  • RF GaN patenting activity slowing as technology matures
  • GaN HEMT short-circuit performance
  • Jilin University achieves record 2DEG mobility for N-polar GaN/AlGaN heterostructures on SiC
  • Power GaN device market growing at 35% CAGR to $3.5bn by 2031, driven by data centers, EVs and industrial systems

Plus, there's the news from organisations such as: 3SP Technologies, 5N Plus, Aeluma, Aehr Test Systems, AEMtec, Alchip, Alcoa, Amaero International, AMD, ams OSRAM, Antae, AQUU Research, Ascent Solar Technologies, ATEK America, ATEK MIDAS, Aurobay Technologies, Avicena Tech, AXT, Ayar Labs, Battalion Advanced Technology, BluGlass, BMW Group, Canadian Semiconductor Council, CETC, Chemconserve, ClassOne Technology, Coherent, Corning, Cree LED, CSconnected, CUbIQ, CVD Equipment, Dauntless Ventures, DB HiTek, Earthrise VC, Efficient Power Conversion (EPC), Eggtronic, Enkris, Ennostar, Ethnicon, European Union, Fiven Norge, Fox ESS, GaNext, GlobalFoundries, Grand View Research, Hanhua Semiconductor, Hitachi Group, Hitachi High-Tech, Horizon, Horse Powertrain, Huawei, Infineon Technologies, Ingantec, Innoscience, Intel, IQE, IVWorks, Jiangsu Institute of Advanced Semiconductors, Jilin University, King Abdullah University of Science and Technology (KAUST), Lockheed Martin, Lumentum, LuxChemTech, Lyocon, MACOM Technology Solutions, MediaTek, Metalogika, Micross Components, Midsummer, Migdal Capital Markets, Modelithics, National Institute of Standards and Technology (NIST), Navitas Semiconductor, Nexperia, NewPhotonics, NGK Insulators, Northrop Grumman, Novo Nordisk Foundation, NUBURU, NVIDIA, Office of Clean Energy Demonstrations, onsemi, OpenLight, Optical Internetworking Forum (OIF), Optica, Penn State University, PicoJool, Plum Alley Ventures, Powerchip Semiconductor Manufacturing Corporation (PSMC), Qorvo, Qualcomm, Qualcomm Technologies, Quantifi Photonics, Quintessent, Quside, Renesas, Research England, Riber, Rockford RDF, ROHM Semiconductor, Samsung, SCIOS, SCR-Sibelco, SemiQ, Shenzhen Pinghu Laboratory, Shin-Etsu, Silanna Semiconductor, Silanna UV, Sivers Semiconductors, Skeleton Technologies, SK Keyfoundry, SMART Photonics, Socratic Partners, Sojitz, SolarEdge Technologies, Southchip, Stanford University, Steinsvik Olivine, STMicroelectronics, Subaru, Sumitomo Chemical, Sumitomo Electric, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Teradyne, Texas Instruments, Toshiba Electronic Devices & Storage Corporation, Topsil GlobalWafers, Tower Semiconductor, TrendForce, Trier University of Applied Sciences, TSMC, Photonics, Vexlum, VLC Photonics, Wacker Chemie, WIN Semiconductors, Wise Integration, Wiwynn, and much more.

If your company is a supplier of equipment, materials, or services for the manufacture of compound semiconductor wafers and devices, and you are involved in marketing those products, then please see Semiconductor Today's 2026 Media Kit.

Semiconductor Today is freely available to all. To learn more and to subscribe, visit: Subscribe for free.

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