News: Microelectronics
28 April 2021
Infineon launches EasyPACK CoolSiC MOSFET module supporting 1500V DC-link solar applications
Infineon Technologies AG of Munich, Germany has launched a new EasyPACK 2B module in the firm’s family of 1200V devices. The module comes in 3-level active NPC (ANPC) topology and integrates CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices and an NTC temperature sensor along with PressFIT contact technology pins. The power module is suitable for fast-switching applications such as energy storage systems (ESS). The module also increases the power rating and efficiency of solar systems and supports the growing demand for 1500V DC-link solar applications.
Picture: Infineon’s EasyPACK 2B CoolSiC 1200V module comes in 3-level Active NPC (ANPC) topology and integrates CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins.
Using the latest CoolSiC MOSFET and TRENCHSTOP IGBT7 technology combined with an increased diode rating, the EasyPACK module F3L11MR12W2M1_B74 (available now) is designed to operate over the entire power factor (cos φ) range. A single module per phase is capable of supplying a power level of up to 75kW in energy-storage applications. For solar applications a power level of up to 150kW can be reached by operating two modules in parallel per phase.
With its improved pin positioning, the module also ensures short and clean commutation loops with reduced stray module inductances. Its optimized layout enables what is claimed to be excellent thermal conduction of the CoolSiC MOSFET chips within the EasyPACK 2B package. In addition, the power module supports easy design-in and provides a high degree of freedom for inverter design.
The new product is being showcased at Infineon’s Virtual Power Conference (available live, 4-6 May), which complements the PCIM Europe (Power Conversion and Intelligent Motion) Digital Days event.
Infineon adds 62mm package to CoolSiC MOSFET 1200V module family
