9 July 2021
Aehr receives $2.9m follow-on order from lead SiC customer
Aehr Test Systems of Fremont, CA, USA says that it has received another follow-on order, this time worth $2.9m, for a FOX-XP wafer-level test and burn-in system and multiple WaferPak contactors from its lead silicon carbide (SiC) customer to provide additional capacity for production test and burn-in of its line of silicon carbide devices. The system is expected to ship during Aehr’s fiscal first-quarter 2021 (to end-August).
The customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market, and is using the FOX-XP system for high-volume production burn-in and infant mortality screening of SiC devices at wafer level for electric vehicle (EV) power modules. The FOX-XP system is configured to test 18 SiC wafers in parallel while contacting and testing 100% of the devices on each wafer.
The additional follow-on order reflects the customer’s increased test capacity needs as they ramp to high-volume wafer-level production test of SiC modules for an electric vehicle application. “The EV market is about to see incredible growth, and we expect this customer will order a significant number of FOX systems, WaferPaks and related consumables that they have forecasted to purchase from Aehr over the next several years,” says president & CEO Gayn Erickson.
“Silicon carbide continues to be promising as a key growth driver for Aehr, and we anticipate that silicon carbide wafer-level burn-in will become the industry standard for low cost and 100% traceability for burn-in and reliability screening,” he adds. The power semiconductor market for electric vehicles is expected to triple between 2020 and 2026, growing at a 25.7% compound annual growth rate (CAGR) to $5.6bn, according to a March report from market research firm Yole Développement. In addition, a July 2020 report from Deloitte forecasts that total EV sales will grow a CAGR of 29% from 2.5 million in 2020 to 11.2 million in 2025, before reaching 31.1 million by 2030 and securing about 32% of the total market share for new car sales.
Available with multiple WaferPak Contactors (full-wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, the FOX-XP system is capable of functional test and burn-in/cycling of integrated devices such as SiC power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, gallium nitride (GaN), magnetic sensors, micro-controllers, and other leading-edge ICs in either wafer form factor (before they are assembled into single or multi-die stacked packages) or in singulated die or module form factor.