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14 October 2021

Picosun reports batch process results from Morpher ALD system acceptance runs

Atomic layer deposition (ALD) thin-film coating technology provider Picosun Group of Espoo, Finland says that its PICOSUN Morpher ALD system has continued to demonstrate excellent batch process results in the latest acceptance runs performed for its customers in the global semiconductor industry. Uniformities of <1% (1sigma) and single-digit particle levels have been reached in a number of acceptance runs with different film materials such as Al2O3 and SiO2.

The Morpher system was launched in 2019 for up to the 200mm wafer markets. The tool’s strength is the adaptability to the changing needs of different business verticals, from corporate R&D to production and foundry manufacturing. It enables fully automatic and high-throughput production of, for example, micro-electro-mechanical systems (MEMS), sensors, light-emitting diodes (LEDs), lasers, power electronics, optics and 5G components.

“The market showed great interest towards PICOSUN Morpher after the launch and it has now become a leading product for the sub-300mm production market,” says Juhana Kostamo, VP, Industrial Business Area, at Picosun Group. “We have delivered PICOSUN Morpher to a variety type of customers, the latest including world-leading manufacturers that use the tool both for pilot and high-volume manufacturing of integrated circuits.”

Earlier this year Picosun Group reported record-breaking batch film quality results with PICOSUN Sprinter, its new-generation tool for 300mm wafer markets.

See related items:

Picosun delivers ALD technology to ams OSRAM

Picosun’s cluster ALD solutions enable next-generation power electronics

Picosun launches ALD product platform for up to 200mm wafer applications

Tags: ALD

Visit: www.picosun.com

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