25 July 2022
III-V Epi meets demand for reduced-lead-time wafer design, manufacture, test and characterization
III-V Epi Ltd of Glasgow, Scotland, UK — which provides a fast-turnaround service for custom compound semiconductor wafer design, manufacturing, test and characterization — says that, by focusing on low- to medium-volume manufacturing, it has been able to provide molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD), III-V, epitaxial structures, and overgrowth services with shorter lead times than the industry standard.
“III-V Epi has helped many customers bring new, compound semiconductor products to market quickly, with its reduced-lead-time manufacture,” says director Calum McGregor. “This has been achieved by using two key strategies. Firstly, by specializing in medium- to low-volume supply, we have been able to separate ourselves from the volume part of the industry, dominated by consumer product giants swallowing up the world’s production capacity. Secondly, we have removed potential NPI [new product introduction] bottlenecks for customers by offering expertise in every part of the process, from wafer design, product development and process optimization through to a complete range of test, metrology and characterization services.”
III-V Epi reckons that its unique approach makes it a suitable supply partner for companies requiring low-volume supply, such as universities, start-ups and smaller-scale industrial businesses. The firm already supplies devices for communications, telecoms, quantum technology, defence, security, automotive, agriculture and additive manufacturing markets.