2 November 2021
onsemi completes acquisition of GTAT
Power semiconductor IC supplier onsemi of Phoenix, AZ, USA has completed its acquisition (announced in late August) of silicon carbide (SiC) and sapphire materials manufacturer GT Advanced Technologies Inc of Hudson, NH, USA, which was founded in 1994. The acquisition enhances onsemi’s ability to secure and grow supply of SiC.
onsemi says that its customers will benefit from GTAT’s experience in crystalline growth as well as its technical capabilities and expertise in the development of wafering-ready SiC.
onsemi intends to scale and accelerate GTAT’s development of SiC to assure customers’ supply of critical components and further commercialize intelligent power technologies.
“As we move to a carbon-free economy, SiC technology is a key driver to enable zero emissions in high-efficiency electric vehicles, renewable energy and charging infrastructure,” says onsemi’s president & CEO Hassane El-Khoury. “By integrating GTAT, onsemi can now provide end-to-end power solutions from SiC crystal growth to fully integrated intelligent power modules,” he adds.
“We are proud to welcome GTAT’s incredibly talented employees to the onsemi family. Their experience and insights in the SiC space are second to none, and we look forward to working together to drive important new innovations that are critical to the growth of the sustainable ecosystem,” El-Khoury continues.
onsemi says that the acquisition reinforces its commitment to make substantial investments in disruptive, high-growth technologies, consistent with its recently announced 2025 target financial model described during its Analyst Day presentation. Capital expenditures are expected to be about 12% of revenue in 2022 and 2023, as onsemi invests to drive differentiation and leadership, including in the SiC ecosystem. onsemi plans to invest in expanding GTAT’s manufacturing facilities, supporting R&D efforts to advance 150mm and 200mm SiC crystal growth technology, while also investing in the broader SiC supply chain, including fab capacity and packaging.