AES Semigas


13 July 2022

MRSI launches latest die bonder for high-power laser makers

MRSI Systems (Mycronic Group) of North Billerica, MA, USA (which makes fully automated, high-precision high-speed eutectic and epoxy die bonding systems) has launched the MRSI-H-HPLD+ (to be available in third-quarter 2022) as the latest advance in its MRSI-H/HVM-series product line.

Tailored for high-power laser die attachment applications, the new variant of the MRSI-H-HPLD is said to significantly improve throughput by using parallel processing while maintaining high accuracy and flexibility.

“MRSI’s die bonders have been widely used over many years by high-power laser manufacturers. This new HPLD+ version takes the performance to the next level,” notes Dr Yi Qian, VP & general manager of MRSI Systems. “This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high-flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing.”

See related items:

MRSI demonstrating 1.5μm high-speed die bonding at Productronica

MRSI-H/HVM-Series die bonder accuracy improved from 3μm to 1.5μm

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder


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